Setikara sa Moahi CL-S621/CL-S621II Sekhomaretsi sa Sekhomaretsi sa Desktop Lileibole Sehatisi sa Thermal Transfer
CL-S621 ke yuniti e entsoeng ka mokhoa o nepahetseng, e potlakileng le e bonolo ho e sebelisa e kenyelletsang bokhoni bohle ba CL-S521 hammoho le khetho ea ho hatisa ka mekhoa ea phetisetso ea mocheso le mocheso.Mochine o hatisang o boetse o na le mochini oa tšepe oa Citizen's Hi-Lift™ le mochini o mocha oa ARCP™ o thibelang wrinkle le sistimi e its'oarang.
Bophara ba pampiri: bophara ba pampiri bo feto-fetohang - 0.5 inch (12.5 mm) - 4.6 inches (118.1 mm)
Pampiri e boima: Moralo o tšoarellang - Mochini o netefalitsoeng oa baahi oa Hi-Lift™ oa all-metal Speed: Ho hatisoa ka potlako - 6 inches ka motsotsoana (150 mm motsotsoana)
Tšehetso ea mecha ea litaba: Bokhoni bo boholo ba mecha ea litaba - bo tšoara meqolo ho fihla ho lisenthimithara tse 5 (127 mm)
Likhetho tsa ribone: Mefuta e mengata ea likhetho tsa ribone - E sebelisa lithapo tsa maqeba tse fihlang ho 360 ka hare le kantle.
Botenya ba pampiri: Botenya ba pampiri ho fihla ho 0.250mm
Hi-Open™ case bakeng sa ho buloa ka ho otloloha, ha ho na keketseho ea maoto le ho koala ka mokhoa o sireletsehileng.
Ha ho sa na lileibole tse ke keng tsa baloa - thekenoloji ea taolo ea ribone ea ARCP™ e netefatsa lingoloa tse hlakileng.
Tlhokahalo ea sebaka se tlase - phepelo ea motlakase e kopaneng e nolofalletsa seteishene sa mosebetsi se hloekileng
Matla: Phepelo ea matla a ka hare bakeng sa ho ts'epahala
Sensor ea mecha ea litaba: Sensor ea letšoao le letšo
Sensor ea media e fetolehang
Label gap sensor
Tear bar: Tear-bar e tloaelehileng bakeng sa li-tag tse nang le perforated
| Theknoloji ea Khatiso | Phetisetso ea Thermal + Thermal Direct |
| Lebelo la ho Hatisa (boholo) | 4 lisenthimithara ka motsotsoana (100 mm/s) |
| Print Width (boholo) | 4 inche (104 mm) |
| Media Width (min ho isa ho max) | 0.5 ho isa ho 4 inches (12.5 ho 118 mm) |
| Botenya ba Media (min ho isa ho max) | 63.5 ho isa ho 254 μm |
| Sensor ea litaba | Lekhalo le feto-fetohang ka botlalo, notch le letšoao le letšo le khanyang |
| Bolelele ba Media (min ho isa ho max) | 0.25 ho isa ho 64 inches (6.35 ho 1625.6 mm) |
| Boholo ba Roll (max), Boholo ba Core | Ka hare bophara ba lisenthimithara tse 5 (125 limilimithara) Bophara ba ka ntle 8 lisenthimithara (200mm) |
| Nyeoe | Hi-Open™ industrial ABS case e nang le sebaka se sireletsehileng |
| Mokhoa | Hi-Lift™ mochini oa tšepe o nang le hlooho e bulehileng haholo |
| Lekhotla la taolo | Likonopo tse 4 le li-LED tse 4 |
| Flash (Memori e sa fetoheng) | 4 MB kakaretso, 1 MB e fumaneha bakeng sa mosebelisi |
| Bakhanni le software | E sa lefelloe mahala ho CD e nang le printa, ho kenyeletsoa ts'ehetso ea liforomo tse fapaneng |
| Boholo (W x D x H) le Boima ba 'mele | 231 x 289 x 270 limilimithara, 4,5 Kg |
| Emulations (Lipuo) | Datamax® I-Class™ & DMX400™ |
| Cross-Emulation™ – ho fetola ka ho iketsa pakeng tsa Zebra® ZPL-II® le Datamax® I-Class®, DMX400 | |
| Zebra® ZPL-II® | |
| Mofetoleli oa BASIC bakeng sa ts'ebetso ea phallo ea data | |
| Boholo ba lente | 2.9 inch (74mm) boholo ba bophara ba kantle.bolelele ba limithara tse 360.1 inch (25mm) konokono |
| Ribbon windings & mofuta | Lehlakore la enke ho kena kapa ho tsoa, switjha e ka khethoang.Mofuta oa boka, boka ba boka / resin kapa resin |
| Sistimi ea ribone | ARCP™ tokiso ea tsitsipano ea ribone ea othomathike |
| RAM (Memori e tloaelehileng) | 16 MB kakaretso, 1 MB e fumaneha bakeng sa mosebedisi |
| Qeto | 203 dpi |
| Sehokelo se ka Sehloohong | Dual Interface Serial (RS-232C), USB (mofuta oa 1.1) |
| Sehokedi | Litekanyetso tsa Wireless LAN 802.11b le 802.11g, limithara tse 100, 64/128 bit WEP, WPA, ho fihla ho 54Mbps |
| Ethernet (10/100 BaseT) | |
| Parallel (IEEE 1284 e lumellana) |